Patent Assignment
Reel/Frame 050043/0387
Assignment of Assignor's Interest
Recorded: 2019-08-13
Pages: 6
Assignors
JEON, CHANG-SEONG
Executed: 2019-01-28
SHIN, SEUNG-HUN
Executed: 2019-01-28
YOON, JAE-KYUNG
Executed: 2019-01-28
LEE, TEAK-HOON
Executed: 2019-01-28
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Method of Cutting Substrate and Method of Singulating Semiconductor Chips