Patent Assignment
Reel/Frame 050103/0977
Assignment of Assignor's Interest
Recorded: 2019-08-20
Pages: 9
Assignors
FUKUZUMI, YOSHIAKI
Executed: 2019-06-07
AOCHI, HIDEAKI
Executed: 2019-06-28
MATSUO, MIE
Executed: 2019-06-28
YOSHII, KENICHIRO
Executed: 2019-05-31
SHINDO, KOICHIRO
Executed: 2019-05-23
KAWASAKI, KAZUSHIGE
Executed: 2019-05-27
SANUKI, TOMOYA
Executed: 2019-06-10
Assignee
TOSHIBA MEMORY CORPORATION
1-1, SHIBAURA 1-CHOME, MINATO-KU, JAPAN
Covered Property
(1)
Semiconductor Memory Device having a Bonded Circuit Chip including a Solid State Drive Controller connected to a Control Circuit
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name and Address
Jan 31, 2022
From: TOSHIBA MEMORY CORPORATION
To: KIOXIA CORPORATION
Reel/Frame 058905/0582 →
Merger
Jan 31, 2022
From: TOSHIBA MEMORY CORPORATION
To: K.K PANGEA
Reel/Frame 058946/0675 →
Change of Name and Address
Feb 4, 2022
From: K.K PANGEA
To: TOSHIBA MEMORY CORPORATION
Reel/Frame 058957/0124 →