Patent Assignment
Reel/Frame 050168/0786
Security Interest
Recorded: 2019-08-26
Pages: 10
Assignor
INSENSE INC.
Executed: 2019-08-19
Assignee
SILICON VALLEY BANK
3003 TASMAN DRIVE, SANTA CLARA, CALIFORNIA, 95054
Covered Properties
(2)
Wafer Scale Monolithic CMOS-Integration of Free- and non-Free-Standing Metal- and Metal alloy-based MEMS Structures in a Sealed Cavity
Wafer Scale Monolithic CMOS-Integration of Free- and Non-Free-Standing Metal- and Metal Alloy-Based MEMS Structures in a Sealed Cavity
Application:
15/481,315 →
Publication:
US 2017/0275156
Related Assignments
(4)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Dec 1, 2016
From: TAYEBI, NOUREDDINE; LUO, HAO
To: INSENSE INC.
Reel/Frame 040483/0031 →
Assignment of Assignor's Interest
Apr 6, 2017
From: TAYEBI, NOUREDDINE; LUO, HAO
To: INSENSE INC.
Reel/Frame 041890/0848 →
Assignment of Assignor's Interest
Jun 2, 2021
From: INSENSE INC.
To: TECTUS CORPORATION
Reel/Frame 056411/0667 →
Termination and Release of Intellectual Property Security Agreement (Reel/Frame 50168/0786)
Jun 18, 2021
From: SILICON VALLEY BANK
To: INSENSE, INC.
Reel/Frame 056805/0585 →