Patent Assignment
Reel/Frame 056411/0667
Assignment of Assignor's Interest
Recorded: 2021-06-02
Pages: 4
Assignor
INSENSE INC.
Executed: 2021-05-28
Assignee
TECTUS CORPORATION
12950 SARATOGA AVE, SARATOGA, CALIFORNIA, 95070
Covered Property
(1)
Wafer Scale Monolithic CMOS-Integration of Free- and non-Free-Standing Metal- and Metal alloy-based MEMS Structures in a Sealed Cavity
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Dec 1, 2016
From: TAYEBI, NOUREDDINE; LUO, HAO
To: INSENSE INC.
Reel/Frame 040483/0031 →
Security Interest
Aug 26, 2019
From: INSENSE INC.
To: SILICON VALLEY BANK
Reel/Frame 050168/0786 →
Termination and Release of Intellectual Property Security Agreement (Reel/Frame 50168/0786)
Jun 18, 2021
From: SILICON VALLEY BANK
To: INSENSE, INC.
Reel/Frame 056805/0585 →