Patent Assignment
Reel/Frame 050182/0840
Assignment of Assignor's Interest
Recorded: 2019-08-27
Pages: 5
Assignor
LEE, JA WOO
Executed: 2019-08-19
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU,, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Substrate Processing Apparatus Including Edge Ring