Substrate processing apparatus including edge ring
A substrate processing apparatus includes a process chamber having a substrate input port, a support disposed in the process chamber and on which a substrate is mounted, an inner edge ring disposed adjacent to the support and having a smaller width than that of the substrate input port, and an outer edge ring disposed adjacent to the inner edge ring and having a greater width than that of the substrate input port.
1. A substrate processing apparatus comprising:
a process chamber having a substrate input port;
a support disposed in the process chamber and on which a substrate is mounted;
an inner edge ring disposed adjacent to the support and having a smaller width than that of the substrate input port, wherein the inner edge ring comprises:
a first ring having a greater width than that of the substrate; and
a second ring overlapping a lower surface of the substrate, wherein the first ring is disposed on the second ring;
an outer edge ring disposed adjacent to the inner edge ring and having a greater width than that of the substrate input port; and
a lift pin disposed adjacent to the inner edge ring, wherein an upper portion of the lift pin contacts the first ring, and a lower portion of the lift pin contacts a lower surface of the second ring while the first ring is disposed on the second ring.
2. The substrate processing apparatus of claim 1 , wherein
the second ring is configured to be in contact with the first ring.
3. The substrate processing apparatus of claim 2 , wherein an upper surface of the second ring and an upper surface of the support are substantially coplanar.
4. The substrate processing apparatus of claim 2 , wherein an upper surface of the second ring protrudes at a higher level than an upper surface of the support.
5. The substrate processing apparatus of claim 2 , wherein an upper surface of the first ring protrudes at a higher level than an upper surface of the substrate.
6. The substrate processing apparatus a claim 2 , wherein the second ring comprises a different material from that of the first ring.
7. The substrate processing apparatus of claim 2 , wherein the second ring comprises silicon carbide (SiC), yttrium oxide (YO), aluminum oxide (AlO), quartz, or a combination thereof.
8. The substrate processing apparatus of claim 2 , wherein the first ring comprises quartz.
9. The substrate processing apparatus of claim 2 , wherein the lift pin passes through the second ring.
10. An edge ring of a substrate processing apparatus, the edge ring comprising:
an inner edge ring having a smaller width than that of a substrate input port disposed in a process chamber; and
an outer edge ring disposed adjacent to the inner edge ring and having a greater width than that of the substrate input port,
wherein the inner edge ring comprises:
a first ring having a greater width than that of a substrate; and
a second ring configured to be in contact with the first ring and overlap a lower surface of the substrate, wherein an upper surface of the first ring is inclined at a predetermined angle with respect to an upper surface of the second ring.
11. A substrate processing apparatus comprising:
a process chamber having a substrate input port;
a support disposed in the process chamber and on which a substrate is mounted;
an inner edge ring disposed adjacent to the support and having a smaller width than that of the substrate input port, wherein the inner edge ring comprises:
a first ring having a greater width than that of the substrate; and
a second ring overlapping a lower surface of the substrate, wherein the first ring is disposed on the second ring;
an outer edge ring disposed adjacent to the inner edge ring and having a greater width than that of the substrate input port;
a lift pin disposed adjacent to the inner edge ring, wherein an upper portion of the lift pin contacts the first ring, and a lower portion of the lift pin contacts a lower surface of the second ring while the first ring is disposed on the second ring;
a transfer apparatus disposed adjacent to the process chamber; and
a ring keeping box disposed adjacent to the transfer apparatus.
12. The substrate processing apparatus of claim 11 , further comprising a preparation chamber disposed between the process chamber and the ring keeping box,
wherein the transfer apparatus comprises:
a first transfer apparatus disposed between the process chamber and the preparation chamber; and
a second transfer apparatus disposed between the preparation chamber and the ring keeping box.
13. The substrate processing apparatus of claim 11 , wherein the inner edge ring is configured to be detached from the support, and transferred through the substrate input port to the ring keeping box by using the transfer apparatus.
14. The substrate processing apparatus of claim 13 , further comprising another inner edge ring disposed in the ring keeping box,
wherein the another edge ring is configured to be transferred through the substrate input port onto the support by using the transfer apparatus, and mounted between the support and the outer edge ring.
15. The substrate processing apparatus of claim 13 , wherein the inner edge ring is detached from the support by moving the inner edge ring using the lift pin.
16. The substrate processing apparatus of claim 11 , wherein the
second ring is configured to be in contact with the first ring and,
wherein the substrate is configured to be mounted on the support, and
the first ring is configured to be moved using the lift pin.
17. The substrate processing apparatus of claim 16 , wherein an upper surface of the first ring protrudes at a higher level than an upper surface of the substrate.