Patent Assignment
Reel/Frame 050185/0140
Assignment of Assignor's Interest
Recorded: 2019-08-27
Pages: 8
Assignors
KIM, TAE KI
Executed: 2019-08-07
SHIM, JAE BEOM
Executed: 2019-08-07
SON, SEUNG NAM
Executed: 2019-08-07
DO, WON CHUL
Executed: 2019-08-07
Assignee
AMKOR TECHNOLOGY KOREA, INC.
100, AMKOR-RO, BUK-GU, GWANGJU, 61006, KOREA, REPUBLIC OF
Covered Property
(1)
Chip Scale Package Including Protective Layers Exhibiting Counteracting Coefficients of Thermal Expansion
Application:
16/387,924 →
Publication:
US 2020/0335441
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.