Patent Assignment
Reel/Frame 052559/0975
Assignment of Assignor's Interest
Recorded: 2020-05-04
Pages: 8
Assignor
AMKOR TECHNOLOGY KOREA, INC.
Executed: 2019-12-17
Assignee
AMKOR TECHNOLOGY SINGAPORE HOLDING PTE. LTD.
491B RIVER VALLEY ROAD, VALLEY POINT #12-03, SINGAPORE, 248373, SINGAPORE
Covered Property
(1)
Chip Scale Package Including Protective Layers Exhibiting Counteracting Coefficients of Thermal Expansion
Application:
16/387,924 →
Publication:
US 2020/0335441
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.