Patent Assignment
Reel/Frame 050209/0368
Assignment of Assignor's Interest
Recorded: 2019-08-29
Pages: 6
Assignors
HO, CHI-CHING
Executed: 2019-08-19
MA, BO-HAO
Executed: 2019-08-19
XUE, YU-TING
Executed: 2019-08-19
TSENG, CHING-HUNG
Executed: 2019-08-22
LU, GUAN-HUA
Executed: 2019-08-22
CHANG, HONG-DA
Executed: 2019-08-22
Assignee
SILICONWARE PRECISION INDUSTRIES CO., LTD.
NO. 123, SEC. 3, DA FONG ROAD, TANTZU, TAICHUNG, TAIWAN
Covered Property
(1)
Carrying Substrate, Electronic Package Having the Carrying Substrate, and Methods for Manufacturing the Same