Patent Assignment
Reel/Frame 050211/0441
Assignment of Assignor's Interest
Recorded: 2019-08-29
Pages: 5
Assignors
CHOI, KWANG-SEONG
Executed: 2019-08-20
EOM, YONG SUNG
Executed: 2019-08-20
JANG, KEONSOO
Executed: 2019-08-20
MOON, SEOK-HWAN
Executed: 2019-08-20
BAE, HYUN-CHEOL
Executed: 2019-08-20
Assignee
ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
218 GAJEONG-RO, YUSEONG-GU, DAEJEON, 34129, KOREA, REPUBLIC OF
Covered Property
(1)
Laser Bonding Method