Patent Assignment
Reel/Frame 050218/0234
Assignment of Assignor's Interest
Recorded: 2019-08-29
Pages: 22
Assignors
WANG, HUI-LIN
Executed: 2019-08-26
WANG, YU-PING
Executed: 2019-08-26
WENG, CHEN-YI
Executed: 2019-08-26
HSIEH, CHIN-YANG
Executed: 2019-08-26
LEE, YI-HUI
Executed: 2019-08-26
LIU, YING-CHENG
Executed: 2019-08-26
SHIH, YI-AN
Executed: 2019-08-26
TSENG, I-MING
Executed: 2019-08-26
JHANG, JING-YIN
Executed: 2019-08-26
LIN, CHIEN-TING
Executed: 2019-08-26
Assignee
UNITED MICROELECTRONICS CORP.
NO.3, LI-HSIN ROAD 2, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU CITY, TAIWAN
Covered Property
(1)
Semiconductor Structure and Method for Forming the Same