Semiconductor structure and method for forming the same
A method for forming a semiconductor structure is disclosed. A substrate having a logic device region and a memory device region is provided. A first dielectric layer is formed on the substrate. Plural memory stack structures are formed on the first dielectric layer on the memory device region. An insulating layer is formed and conformally covers the memory stack structures and the first dielectric layer. An etching back process is performed to remove a portion of the insulating layer without exposing any portion of the memory stack structures. After the etching back process, a second dielectric layer is formed on the insulating layer and completely fills the spaces between the memory stack structures.
1. A semiconductor structure, comprising:
a substrate having a memory device region and a logic device region;
a first dielectric layer on the substrate;
a plurality of memory stack structures on the first dielectric layer on the memory device region;
an insulating layer conformally covering the memory stack structures and the first dielectric layer, wherein a thickness of the insulating layer on top surfaces of the memory stack structures is smaller than a thickness of the insulating layer on sidewalls of the memory stack structures; and
a second dielectric layer on the substrate and completely filling the spaces between the memory stack structures, wherein a top surface of the second dielectric layer on the insulating layer on the top surfaces of the memory stack structures and a top surface of the second dielectric layer on the logic device region are coplanar.
2. The semiconductor structure according to claim 1 , wherein the memory stack structures and the first dielectric layer are not in direct contact with the second dielectric layer by being covered by the insulating layer.
3. The semiconductor structure according to claim 1 , further comprising an interconnecting structure formed in the second dielectric layer on the logic device region, wherein a top surface of the interconnecting structure is flush with the top surface of the second dielectric layer on the insulating layer on the top surfaces of the memory stack structures and higher than the top surfaces of the memory stack structures.
4. The semiconductor structure according to claim 1 , wherein the first dielectric layer comprises an etching stop layer and a first dielectric material layer on the etching stop layer, wherein the first dielectric material layer on the logic device region is removed and the second dielectric layer is in direct contact with the etching stop layer on the logic device region of the substrate.
5. The semiconductor structure according to claim 1 , wherein the first dielectric layer comprises a silicon carbon nitride (SiCN) layer and a silicon oxide (SiO 2 ) layer, the second dielectric layer comprises a low-k dielectric layer.
6. The semiconductor structure according to claim 1 , wherein the memory stack structures respectively comprise:
a bottom electrode layer;
a MTJ stack layer on the bottom electrode layer; and
a top electrode layer on the MTJ stack layer.
7. The semiconductor structure according to claim 1 , further comprising a plurality of bottom vias in the first dielectric layer on the memory device region, wherein each of the memory stack structures are directly disposed on one of the bottom vias.