Patent Assignment
Reel/Frame 050218/0925
Assignment of Assignor's Interest
Recorded: 2019-08-30
Pages: 5
Assignors
KANG, JUN-GOO
Executed: 2019-06-26
LEE, HYUN-SUK
Executed: 2019-06-26
CHO, GI-HEE
Executed: 2019-06-26
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Integrated Circuit Device and Method of Manufacturing the Same