IP Library › Assignment 050245/0508
Patent Assignment
Reel/Frame 050245/0508

Assignment of Assignor's Interest

Recorded: 2019-09-03 Pages: 6
Assignors
CHEN, FEIBIAO
Executed: 2019-08-26
XIA, HAI
Executed: 2019-08-26
ZHU, YUEBIN
Executed: 2019-08-26
CHENG, HAILIN
Executed: 2019-08-26
JIANG, XIAOYU
Executed: 2019-08-27
ZHAO, LILI
Executed: 2019-08-27
ZHANG, DONGHAO
Executed: 2019-08-27
Assignee
SHANGHAI MICRO ELECTRONICS EQUIPMENT (GROUP) CO., LTD
1525 ZHANGDONG ROAD, ZHANGJIANG HIGH-TECH PARK,, SHANGHAI, 201203, CHINA
Covered Property (1)
Chip Bonding Device
Application: 16/489,198 →
Publication: US 2019/0378741
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Sep 17, 2025
From: SHANGHAI MICRO ELECTRONICS EQUIPMENT (GROUP) CO., LTD.
To: AMIES TECHNOLOGY CO., LTD.
Reel/Frame 072912/0466 →