Patent Assignment
Reel/Frame 050252/0316
Assignment of Assignor's Interest
Recorded: 2019-09-03
Pages: 4
Assignors
CHEN, MING-FA
Executed: 2019-08-02
LIU, TZUAN-HORNG
Executed: 2019-08-02
SHIH, CHAO-WEN
Executed: 2019-08-02
YEH, SUNG-FENG
Executed: 2019-08-02
WU, NIEN-FANG
Executed: 2019-08-02
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Integrated Circuit Package and Method