Patent Assignment
Reel/Frame 050252/0372
Assignment of Assignor's Interest
Recorded: 2019-09-03
Pages: 4
Assignors
LAI, YU-CHIA
Executed: 2019-07-05
HSIEH, CHENG-CHIEH
Executed: 2019-07-05
KUO, TIN-HAO
Executed: 2019-07-05
TSAI, HAO-YI
Executed: 2019-07-05
LIU, CHUNG-SHI
Executed: 2019-07-18
YU, CHEN-HUA
Executed: 2019-07-19
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Integrated Fan-Out Device, 3D-IC System, and Method