Patent Assignment
Reel/Frame 050253/0331
Assignment of Assignor's Interest
Recorded: 2019-09-03
Pages: 5
Assignors
YEH, TING-YU
Executed: 2019-07-30
CHEN, CING-HE
Executed: 2019-07-30
TING, KUO-CHIANG
Executed: 2019-07-30
CHEN, WEIMING CHRIS
Executed: 2019-07-30
HSU, CHIA-HAO
Executed: 2019-07-30
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Semiconductor Package with Heat Dissipation Films and Manufacturing Method Thereof