Patent Assignment
Reel/Frame 050253/0750
Assignment of Assignor's Interest
Recorded: 2019-09-04
Pages: 6
Assignors
TENG, PO-YUAN
Executed: 2019-07-26
KUO, HUNG-YI
Executed: 2019-07-29
TSAI, HAO-YI
Executed: 2019-07-29
KUO, TIN-HAO
Executed: 2019-07-26
LAI, YU-CHIA
Executed: 2019-07-26
CHEN, SHIH-WEI
Executed: 2019-07-26
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Semiconductor Device Having a Heat Dissipation Structure Connected Chip Package