Patent Assignment
Reel/Frame 050298/0606
Assignment of Assignor's Interest
Recorded: 2019-09-06
Pages: 10
Assignors
HIROCHI, YUKITOMO
Executed: 2019-08-28
YUASA, KAZUHIRO
Executed: 2019-08-26
YAMAMOTO, TETSUO
Executed: 2019-08-26
YANAGISAWA, YOSHIHIKO
Executed: 2019-08-26
SASAKI, SHINYA
Executed: 2019-08-26
MICHITA, NORIAKI
Executed: 2019-08-26
Assignee
KOKUSAI ELECTRIC CORPORATION
3-4, KANDAKAJI-CHO, CHIYODA-KU, TOKYO, 101-0045, JAPAN
Covered Property
(1)
Substrate Processing Apparatus, Method of Manufacturing Semiconductor Device, and Recording Medium