Patent Assignment
Reel/Frame 050422/0509
Assignment of Assignor's Interest
Recorded: 2019-09-19
Pages: 4
Assignee
YANGTZE MEMORY TECHNOLOGIES CO., LTD.
18 GAOXIN 4TH ROAD, EAST LAKE HIGH-TECH DEVELOPMENT ZONE, WUHAN, HUBEI, CHINA
Covered Property
(1)
Bonded Unified Semiconductor Chips and Fabrication and Operation Methods Thereof