Bonded unified semiconductor chips and fabrication and operation methods thereof
Embodiments of bonded unified semiconductor chips and fabrication and operation methods thereof are disclosed. In an example, a unified semiconductor chip includes a first semiconductor structure including one or more processors, an array of embedded DRAM cells, and a first bonding layer including a plurality of first bonding contacts. The unified semiconductor chip also includes a second semiconductor structure including an array of NAND memory cells and a second bonding layer including a plurality of second bonding contacts. The unified semiconductor chip further includes a bonding interface between the first bonding layer and the second bonding layer. The first bonding contacts are in contact with the second bonding contacts at the bonding interface.
1. A unified semiconductor chip, comprising:
a first semiconductor structure comprising one or more processors, an array of embedded dynamic random-access memory (DRAM) cells, and a first bonding layer comprising a plurality of first bonding contacts;
a second semiconductor structure comprising an array of NAND memory cells and a second bonding layer comprising a plurality of second bonding contacts; and
a bonding interface between the first bonding layer and the second bonding layer, wherein the first bonding contacts are in contact with the second bonding contacts at the bonding interface.
2. The unified semiconductor chip of claim 1 , wherein the first semiconductor structure comprises:
a substrate;
the one or more processors on the substrate;
the array of embedded DRAM cells on the substrate and outside of the one or more processors; and
the first bonding layer above the one or more processors and the array of embedded DRAM cells.
3. The unified semiconductor chip of claim 2 , wherein the second semiconductor structure comprises:
the second bonding layer above the first bonding layer;
a memory stack above the second bonding layer;
an array of three-dimensional (3D) NAND memory strings extending vertically through the memory stack; and
a semiconductor layer above and in contact with the array of 3D NAND memory strings.
4. The unified semiconductor chip of claim 2 , wherein the second semiconductor structure comprises:
the second bonding layer above the first bonding layer;
an array of two-dimensional (2D) NAND memory cells above the second bonding layer; and
a semiconductor layer above and in contact with the array of 2D NAND memory cells.
5. The unified semiconductor chip of claim 1 , wherein the second semiconductor structure comprises:
a substrate;
a memory stack above the substrate;
an array of 3D NAND memory strings extending vertically through the memory stack; and
the second bonding layer above the memory stack and the array of 3D NAND memory strings.
6. The unified semiconductor chip of claim 1 , wherein the second semiconductor structure comprises:
a substrate;
an array of 2D NAND memory cells on the substrate; and
the second bonding layer above the array of 2D NAND memory cells.
7. The unified semiconductor chip of claim 1 , wherein the one or more processors and the array of embedded DRAM cells are stacked one over another.
8. The unified semiconductor chip of claim 1 , wherein each embedded DRAM cell comprises a transistor and a capacitor.
9. The unified semiconductor chip of claim 1 , wherein the first semiconductor structure comprises a first interconnect layer vertically between the first bonding layer and the one or more processors, and the second semiconductor structure comprises a second interconnect layer vertically between the second bonding layer and the array of NAND memory cells.
10. The unified semiconductor chip of claim 9 , wherein the one or more processors are electrically connected to the array of NAND memory cells through the first and second interconnect layers and the first and second bonding contacts.
11. The unified semiconductor chip of claim 9 , wherein the array of embedded DRAM cells are electrically connected to the array of NAND memory cells through the first and second interconnect layers and the first and second bonding contacts.
12. The unified semiconductor chip of claim 1 , wherein the one or more processors comprise an application processor and a baseband processor.
13. The unified semiconductor chip of claim 1 , wherein the first semiconductor structure further comprises one or more controllers.
14. A method for forming a unified semiconductor chip, comprising:
forming a first semiconductor structure comprising one or more processors, an array of embedded dynamic random-access memory (DRAM) cells, and a first bonding layer comprising a plurality of first bonding contacts;
forming a second semiconductor structure comprising an array of NAND memory cells and a second bonding layer comprising a plurality of second bonding contacts; and
bonding the first semiconductor structure and the second semiconductor structure in a face-to-face manner, such that the first bonding contacts are in contact with the second bonding contacts at a bonding interface.
15. The method of claim 14 , wherein forming the first semiconductor structure comprises:
forming the one or more processors and the array of embedded DRAM cells on a first substrate;
forming a first interconnect layer above the one or more processors and the array of embedded DRAM cells; and
forming the first bonding layer above the first interconnect layer.
16. The method of claim 15 , wherein forming the one or more processors and the array of embedded DRAM cells comprises:
forming a plurality of transistors on the first substrate; and
forming a plurality of capacitors above and in contact with some of the transistors.
17. The method of claim 14 , wherein forming the second semiconductor structure comprises:
forming a memory stack above a second substrate;
forming an array of three-dimensional (3D) NAND memory strings extending vertically through the memory stack;
forming a second interconnect layer above the array of 3D NAND memory strings; and
forming the second bonding layer above the second interconnect layer.
18. The method of claim 14 , wherein forming the second semiconductor structure comprises:
forming an array of two-dimensional (2D) NAND memory cells on a second substrate;
forming a second interconnect layer above the array of 2D NAND memory cells; and
forming the second bonding layer above the second interconnect layer.
19. A method for operating a unified semiconductor chip comprising one or more processors, an array of embedded dynamic random-access memory (DRAM) cells, and an array of NAND memory cells in a same bonded chip, the method comprising:
transferring data from the one or more processors to the array of embedded DRAM cells;
buffering the data in the array of embedded DRAM cells; and
storing the data in the array of NAND memory cells from the array of embedded DRAM cells.
20. The method of claim 19 , further comprising transferring the data between the one or more processors and the array of NAND memory cells through a plurality of bonding contacts.