Patent Assignment
Reel/Frame 050422/0646
Assignment of Assignor's Interest
Recorded: 2019-09-19
Pages: 4
Assignors
CHEN, MING-FA
Executed: 2019-08-30
CHEN, HSIEN-WEI
Executed: 2019-08-30
YEH, SUNG-FENG
Executed: 2019-08-30
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Package and Manufacturing Method Thereof