IP Library › Assignment 050462/0789
Patent Assignment
Reel/Frame 050462/0789

Assignment of Assignor's Interest

Recorded: 2019-09-23 Pages: 4
Assignor
AIC HÖRMANN GMBH & CO. KG
Executed: 2019-08-13
Assignee
HERAEUS DEUTSCHLAND GMBH & CO. KG
HERAEUSSTRASSE 12-14, HANAU, 63450, GERMANY
Covered Property (1)
Method for Improving Ohmic Contact Behaviour Between a Contact Grid and an Emitter Layer of a Silicon Solar Cell
Application: 16/317,979 →
Publication: US 2021/0288208
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Sep 19, 2019
From: HONGMING, ZHAO
To: AIC HÖRMANN GMBH & CO. KG
Reel/Frame 050428/0831 →
Assignment of Assignor's Interest Sep 16, 2021
From: HERAEUS DEUTSCHLAND GMBH & CO. KG
To: CE CELL ENGINEERING GMBH
Reel/Frame 057506/0575 →