IP Library › Assignment 050478/0373
Patent Assignment
Reel/Frame 050478/0373

Assignment of Assignor's Interest

Recorded: 2019-09-24 Pages: 4
Assignor
ZHANG, GUOMIN
Executed: 2019-09-23
Assignee
WUHAN XINXIN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 18, GAOXIN 4TH ROAD, DONGHU DEVELOPMENT ZONE, WUHAN, HUBEI, 430205, CHINA
Covered Property (1)
Wafer Structure and Chip Structure Having Through-Hole Electrical Connection for Bonded Chips
Application: 16/581,093 →
Publication: US 2021/0028218
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Corrective Assignment to Correct the Mistyped Application Number on the Assignment Previously Recorded at Reel: 050478 Frame: 0373. Assignor(S) Hereby Confirms the Assignment. Oct 10, 2019
From: ZHANG, GUOMIN
To: WUHAN XINXIN SEMICONDUCTOR MANUFACTURING CO., LTD.
Reel/Frame 050709/0828 →