Corrective Assignment to Correct the Mistyped Application Number on the Assignment Previously Recorded at Reel: 050478 Frame: 0373. Assignor(S) Hereby Confirms the Assignment.

Recorded: 2019-10-10 Pages: 7

Assignor

ZHANG, GUOMIN

Executed: 2019-09-23

Assignee

NO. 18, GAOXIN 4TH ROAD, DONGHU DEVELOPMENT ZONE, WUHAN, HUBEI, 430205, CHINA

Covered Property (1)

Wafer Structure and Chip Structure Having Through-Hole Electrical Connection for Bonded Chips

Patent: 11,282,885 →

Application: 16/581,093 →

Publication: US 2021/0028218

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.