Patent Assignment
Reel/Frame 050484/0794
Assignment of Assignor's Interest
Recorded: 2019-09-25
Pages: 3
Assignors
MORITA, KOUJI
Executed: 2012-09-10
MURAI, HIKARI
Executed: 2012-09-10
TAKANEZAWA, SHIN
Executed: 2012-09-10
INOUE, YASUO
Executed: 2012-09-10
SAKAI, KAZUNAGA
Executed: 2012-09-10
Assignee
HITACHI CHEMICAL COMPANY, LTD.
1-1, NISHISHINJUKU 2-CHOME, SHINJUKU-KU, TOKYO, 1630449, JAPAN
Covered Property
(1)
Varnish, Prepreg, Film with Resin, Metal Foil-Clad Laminate, and Printed Circuit Board
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Address
Sep 25, 2019
From: HITACHI CHEMICAL COMPANY, LTD.
To: HITACHI CHEMICAL COMPANY, LTD.
Reel/Frame 050488/0294 →
Change of Name
Mar 2, 2023
From: HITACHI CHEMICAL COMPANY, LTD.
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 062917/0865 →
Change of Name
Mar 3, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 062946/0125 →
Change of Address
Feb 14, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066599/0037 →