IP Library Assignment 050488/0294
Patent Assignment
Reel/Frame 050488/0294

Change of Address

Recorded: 2019-09-25 Pages: 2
Assignor
HITACHI CHEMICAL COMPANY, LTD.
Executed: 2013-01-01
Assignee
HITACHI CHEMICAL COMPANY, LTD.
9-2, MARUNOUCHI 1-CHOME, CHIYODA-KU, TOKYO, 100-6606, JAPAN
Covered Property (1)
Varnish, Prepreg, Film with Resin, Metal Foil-Clad Laminate, and Printed Circuit Board
Application: 16/124,987 →
Publication: US 2019/0002728
Related Assignments (4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Sep 25, 2019
From: MORITA, KOUJI; MURAI, HIKARI; TAKANEZAWA, SHIN; INOUE, YASUO
To: HITACHI CHEMICAL COMPANY, LTD.
Reel/Frame 050484/0794 →
Change of Name Mar 2, 2023
From: HITACHI CHEMICAL COMPANY, LTD.
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 062917/0865 →
Change of Name Mar 3, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 062946/0125 →
Change of Address Feb 14, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066599/0037 →