Patent Assignment
Reel/Frame 050581/0100
Assignment of Assignor's Interest
Recorded: 2019-10-01
Pages: 7
Assignors
KIM, JI HWANG
Executed: 2019-05-13
SHIM, JONG BO
Executed: 2019-05-16
LEE, JANG WOO
Executed: 2019-05-16
KONG, YUNG CHEOL
Executed: 2019-05-16
HYUN, YOUNG HOON
Executed: 2019-05-17
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Packages Including a Lower Structure, an Upper Structure on the Lower Structure, and a Connection Pattern Beteewn the Lower Structure and the Upper Structure