Patent Assignment
Reel/Frame 050590/0690
Assignment of Assignor's Interest
Recorded: 2019-10-01
Pages: 5
Assignors
PENG, CHENG-YI
Executed: 2019-08-23
HSIEH, WEN-HSING
Executed: 2019-09-03
CHEN, WEN-YUAN
Executed: 2019-09-03
HO, JON-HSU
Executed: 2019-09-04
LEE, SONG-BOR
Executed: 2019-08-29
TIEN, BOR-ZEN
Executed: 2019-09-10
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO.8, LI-HSIN RD. 6, SCIENCE BASED INDUSTRIAL PARK, HSINCHU, 300, TAIWAN
Covered Property
(1)
Method of Manufacturing a Semiconductor Device and a Semiconductor Device