Patent Assignment
Reel/Frame 050620/0384
Assignment of Assignor's Interest
Recorded: 2019-10-03
Pages: 5
Assignee
MICRON TECHNOLOGY, INC.
8000 S. FEDERAL WAY, P.O. BOX 6, BOISE, IDAHO, 83707-0006
Covered Property
(1)
Stacked Semiconductor Die Assemblies with Partitioned Logic and Associated Systems and Methods
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.