IP Library Assignment 050629/0670
Patent Assignment
Reel/Frame 050629/0670

Assignment of Assignor's Interest

Recorded: 2019-10-04 Pages: 6
Assignors
FURUE, KENTARO
Executed: 2019-07-02
MIYAISHI, YUKI
Executed: 2019-07-02
NAKAMURA, SHIYUKO
Executed: 2017-03-01
Assignee
SHOWA DENKO K.K.
13-9, SHIBA DAIMON 1-CHOME, MINATO-KU, TOKYO, 105-8518, JAPAN
Covered Property (1)
Photosensitive Resin Composition
Application: 16/500,881 →
Publication: US 2020/0033726
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name Jun 23, 2023
From: SHOWA DENKO K.K.
To: RESONAC CORPORATION
Reel/Frame 064082/0513 →
Nunc Pro Tunc Assignment May 29, 2024
From: RESONAC CORPORATION
To: NIPPON POLYTECH CORP.
Reel/Frame 067556/0335 →
Change of Address May 29, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 067566/0542 →