IP Library › Assignment 067566/0542
Patent Assignment
Reel/Frame 067566/0542

Change of Address

Recorded: 2024-05-29 Pages: 8
Assignor
RESONAC CORPORATION
Executed: 2023-10-01
Assignee
RESONAC CORPORATION
9-1, HIGASHI-SHIMBASHI 1-CHOME, MINATO-KU, TOKYO, 105-7325, JAPAN
Covered Properties (4)
Positive Photosensitive Resin Composition
Application: 15/755,336 →
Publication: US 2018/0253003
Photosensitive Resin Composition
Application: 16/500,881 →
Publication: US 2020/0033726
Photosensitive Resin Composition, Organic El Element Barrier Rib, and Organic El Element
Application: 16/564,124 →
Publication: US 2020/0081343
Photosensitive Resin Composition, Organic El Element Barrier Rib, and Organic El Element
Application: 16/663,778 →
Publication: US 2020/0249572
Related Assignments (6)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Feb 26, 2018
From: FURUE, KENTARO; MIYAISHI, YUKI
To: SHOWA DENKO K.K.
Reel/Frame 045040/0092 →
Assignment of Assignor's Interest Sep 9, 2019
From: FURUE, KENTARO; MIYAISHI, YUKI
To: SHOWA DENKO K.K.
Reel/Frame 050314/0477 →
Assignment of Assignor's Interest Oct 4, 2019
From: FURUE, KENTARO; MIYAISHI, YUKI; NAKAMURA, SHIYUKO
To: SHOWA DENKO K.K.
Reel/Frame 050629/0670 →
Assignment of Assignor's Interest Oct 25, 2019
From: FURUE, KENTARO; ARAI, YOSHIKAZU
To: SHOWA DENKO K.K.
Reel/Frame 050829/0941 →
Change of Name Jun 23, 2023
From: SHOWA DENKO K.K.
To: RESONAC CORPORATION
Reel/Frame 064082/0513 →
Nunc Pro Tunc Assignment May 29, 2024
From: RESONAC CORPORATION
To: NIPPON POLYTECH CORP.
Reel/Frame 067556/0335 →