IP Library Granted Patent US 11,650,499
Granted Patent B2
US 11,650,499 · App. 16/663,778 · Granted May 16, 2023

Photosensitive resin composition, organic EL element barrier rib, and organic EL element

Inventors: Kentaro Furue (Tokyo, JP); Yoshikazu Arai (Tokyo, JP)
Assignee: SHOWA DENKO K.K.
G03F7/033G03F7/0045G03F7/028
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Quick Facts
Patent No.
US 11,650,499
App. No.
16/663,778
Granted
May 16, 2023
Kind
B2
Abstract

There is provided a highly sensitive colorant-containing photosensitive resin composition that can form an excellent crack resistant cured product for use in the formation of organic EL element barrier ribs. One embodiment of the photosensitive resin composition for use in organic EL element barrier ribs comprises: (A) a binder resin; (B) a phenolic hydroxyl group-containing compound having a molecular weight of 260 to 5,000 and a phenolic hydroxyl group equivalent of 80 to 155; (C) a radiation sensitive compound; and (D) a colorant selected from the group consisting of black dyes and black pigments.

Claims (27)

1. A photosensitive resin composition for an organic EL element barrier rib comprising:

(A) a binder resin;

(B) a phenolic hydroxyl group-containing compound having a molecular weight of 260 to 5,000 and a phenolic hydroxyl group equivalent of 80 to 155;

(C) a radiation sensitive compound; and

(D) a colorant selected from the group consisting of black dyes and black pigments,

wherein the radiation sensitive compount (C) is a photoacid generator.

2. The photosensitive resin composition according to claim 1 wherein the molecular weight of the phenolic hydroxyl group-containing compound (B) is 270 to 4,000.

3. The photosensitive resin composition according to claim 1 wherein the phenolic hydroxyl group-containing compound (B) is at least one selected from the group consisting of tris(4-hydroxyphenyl)methane, 1,1,1-tris(4-hydroxyphenyl)ethane, a,a,a′-tris(4-hydroxyphenyl)-1-ethyl-4-isopropylbenzene, a phenol novolak resin, a cresol novolak resin, a naphthalenediol phenolic resin, a salicylaldehyde phenolic resin, a triphenylmethane phenolic resin, and a biphenylaralkyl phenolic resin.

4. The photosensitive resin composition according to claim 1 comprising 0.1 parts by mass to 20 parts by mass of the phenolic hydroxyl group-containing compound (B) with respect to 100 parts by mass of the total of the binder resin (A), the phenolic hydroxyl group-containing compound (B), the radiation sensitive compound (C), and the colorant (D).

5. The photosensitive resin composition according to claim 1 wherein the radiation sensitive compound (C) is at least one photoacid generator selected from the group consisting of quinone diazide compounds, sulfonium salts, phosphonium salts, diazonium salts, and iodonium salts.

6. The photosensitive resin composition according to claim 1 wherein the binder resin (A) has an alkali-soluble functional group.

7. The photosensitive resin composition according claim 1 comprising 1 part by mass to 70 parts by mass of the colorant (D) with respect to 100 parts by mass of the total of the binder resin (A), the phenolic hydroxyl group-containing compound (B), the radiation sensitive compound (C), and the colorant (D).

8. The photosensitive resin composition according to claim 1 comprising a photoacid generator as 5 parts by mass to 50 parts by mass of the radiation sensitive compound (C) with respect to 100 parts by mass of the total of the binder resin (A), the phenolic hydroxyl group-containing compound (B), the radiation sensitive compound (C), and the colorant (D).

9. The photosensitive resin composition according to claim 1 wherein the optical density (OD value) of a cured coating of the photosensitive resin composition is at least 0.5 per μm of film thickness.

10. The photosensitive resin composition according to claim 1 wherein the binder resin (A) comprises at least one selected from the group consisting of:

(a) a polyalkenylphenolic resin having a structural unit represented by formula (1)

wherein in formula (1), R 1 , R 2 , and R 3 each independently represent a hydrogen atom; an alkyl group with 1 to 5 carbon atoms; an alkenyl group represented by formula (2)

wherein in formula (2), R 6 , R 7 , R 8 , R 9 , and R 10 each independently represent a hydrogen atom, an alkyl group with 1 to 5 carbon atoms, a cycloalkyl group with 5 to 10 carbon atoms, or an aryl group with 6 to 12 carbon atoms, the * in formula (2) represents the bond with the carbon atom constituting the aromatic ring; an alkoxy group with 1 or 2 carbon atoms; or a hydroxyl group, and at least one of R 1 , R 2 and R 3 is the alkenyl group represented by formula (2), Q is an alkylene group represented by the formula —CR 4 R 5 —, a cycloalkylene group with 5 to 10 carbon atoms, a divalent organic group having an aromatic ring, a divalent organic group having an alicyclic fused ring, or a divalent group consisting of a combination thereof, R 4 and R 5 each independently represent a hydrogen atom, an alkyl group with 1 to 5 carbon atoms, an alkenyl group with 2 to 6 carbon atoms, a cycloalkyl group with 5 to 10 carbon atoms or an aryl group with 6 to 12 carbon atoms;

(b) a hydroxypolystyrene resin derivative having a structural unit represented by formula (3)

wherein in formula (3), R 11 is a hydrogen atom or an alkyl group with 1 to 5 carbon atoms, a is an integer from 1 to 4, b is an integer from 1 to 4, a+b is within the range of 2 to 5, R 12 is at least one selected from the group consisting of a hydrogen atom, a methyl group, an ethyl group and a propyl group;

(c) an aqueous alkaline solution-soluble resin having an epoxy group and a phenolic hydroxyl group; and

(d) an aqueous alkaline solution-soluble copolymer of a polymerizable monomer having an alkali-soluble functional group and an additional polymerizable monomer.

11. The photosensitive resin composition according to claim 10 wherein the binder resin (A) comprises at least one selected from the group consisting of:

(c) an aqueous alkaline solution-soluble resin having an epoxy group and a phenolic hydroxyl group; and

(d) an aqueous alkaline solution-soluble copolymer of a polymerizable monomer having an alkali-soluble functional group and an additional polymerizable monomer.

12. An organic EL element barrier rib comprising a cured product of the photosensitive resin composition according to claim 1 .

13. An organic EL element comprising a cured product of the photosensitive resin composition according to claim 1 .

Assignments (4)
NUNC PRO TUNC ASSIGNMENT Recorded May 29, 2024
From: RESONAC CORPORATION
To: NIPPON POLYTECH CORP.
Reel/Frame 067556/0335 →
CHANGE OF ADDRESS Recorded May 29, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 067566/0542 →
CHANGE OF NAME Recorded Jun 23, 2023
From: SHOWA DENKO K.K.
To: RESONAC CORPORATION
Reel/Frame 064082/0513 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 25, 2019
From: FURUE, KENTARO; ARAI, YOSHIKAZU
To: SHOWA DENKO K.K.
Reel/Frame 050829/0941 →
Priority Claims (2)
JP JP2019-019507 · Feb 6, 2019 · national
JP JP2019-098601 · May 27, 2019 · national
Continuity (1)
Related Publication 20200249572A1 · Aug 6, 2020