Patent Assignment
Reel/Frame 050637/0658
Assignment of Assignor's Interest
Recorded: 2019-10-04
Pages: 2
Assignor
KATO, NAOKI
Executed: 2019-09-20
Assignee
U-MHI PLATEC CO., LTD.
1, AZA TAKAMICHI, IWATSUKA-CHO, NAKAMURA-KU,, NAGOYA-SHI, AICHI, 4530862, JAPAN
Covered Property
(1)
Mold Platen, Mold Clamping Device, Injection Molding Device
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Corrective Assignment to Correct the Assignee's Name Previously Recorded at Reel: 050637 Frame: 0658. Assignor(S) Hereby Confirms the Assignment.
May 20, 2020
From: KATO, NAOKI
To: U-MHI PLATECH CO., LTD.
Reel/Frame 052712/0121 →
Merger
Jan 11, 2021
From: U-MHI PLATECH CO., LTD.
To: UBE MACHINERY CORPORATION, LTD.
Reel/Frame 054877/0791 →