IP Library Assignment 052712/0121
Patent Assignment
Reel/Frame 052712/0121

Corrective Assignment to Correct the Assignee's Name Previously Recorded at Reel: 050637 Frame: 0658. Assignor(S) Hereby Confirms the Assignment.

Recorded: 2020-05-20 Pages: 4
Assignor
KATO, NAOKI
Executed: 2019-09-20
Assignee
U-MHI PLATECH CO., LTD.
1, AZA TAKAMICHI, IWATSUKA-CHO, NAKAMURA-KU,, NAGOYA-SHI, AICHI, 4530862, JAPAN
Covered Property (1)
Mold Platen, Mold Clamping Device, Injection Molding Device
Application: 16/603,030 →
Publication: US 2020/0189161
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Oct 4, 2019
From: KATO, NAOKI
To: U-MHI PLATEC CO., LTD.
Reel/Frame 050637/0658 →
Merger Jan 11, 2021
From: U-MHI PLATECH CO., LTD.
To: UBE MACHINERY CORPORATION, LTD.
Reel/Frame 054877/0791 →