Patent Assignment
Reel/Frame 050659/0432
Assignment of Assignor's Interest
Recorded: 2019-10-09
Pages: 3
Assignor
POWERCHIP TECHNOLOGY CORPORATION
Executed: 2019-06-28
Assignee
POWERCHIP SEMICONDUCTOR MANUFACTURING CORPORATION
NO. 18, LI-HSIN RD. 1, HSINCHU SCIENCE PARK,, HSINCHU, TAIWAN
Covered Property
(1)
Integrated Circuit Structure and Manufacturing Method Thereof
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.