Patent Assignment
Reel/Frame 050668/0591
Assignment of Assignor's Interest
Recorded: 2019-10-09
Pages: 5
Assignors
ITO, TOMOMI
Executed: 2019-09-27
YAMAMOTO, ATSUHIKO
Executed: 2019-10-02
MASAGAKI, ATSUSHI
Executed: 2019-09-27
Assignee
SONY SEMICONDUCTOR SOLUTIONS CORPORATION
4-14-1 ASAHI-CHO, ATSUGI-SHI, KANAGAWA, 243-0014, JAPAN
Covered Property
(1)
Solid-State Imaging Device Configured by Electrically Bonding the Respective Electrodes of a Plurality of Semiconductor Chips