Patent Assignment
Reel/Frame 050685/0485
Assignment of Assignor's Interest
Recorded: 2019-10-10
Pages: 4
Assignors
CHEN, YU-MING
Executed: 2019-06-28
LIN, YU-SUNG
Executed: 2019-06-28
KUO, TAI-HUNG
Executed: 2019-06-28
Assignee
ADVANCED SEMICONDUCTOR ENGINEERING, INC.
26 CHIN 3RD ROAD, NANTZE EXPORT PROCESSING ZONE, KAOHSIUNG, TAIWAN
Covered Property
(1)
Semiconductor Package Structure, Product and Method for Manufacturing the Same