Patent Assignment
Reel/Frame 050723/0420
Assignment of Assignor's Interest
Recorded: 2019-10-15
Pages: 4
Assignors
HO, CHENG-LIN
Executed: 2019-07-15
LEE, CHIH-CHENG
Executed: 2019-07-15
CHEN, CHUN CHEN
Executed: 2019-07-15
YU, YUANHAO
Executed: 2019-07-15
Assignee
ADVANCED SEMICONDUCTOR ENGINEERING, INC.
26 CHIN 3RD ROAD, NANTZE EXPORT PROCESSING ZONE, KAOHSIUNG, TAIWAN
Covered Property
(1)
Semiconductor Device Package and Method of Manufacturing the Same