Patent Assignment
Reel/Frame 050734/0902
Assignment of Assignor's Interest
Recorded: 2019-10-16
Pages: 3
Assignor
ELUMALAI, KARTHIK
Executed: 2019-10-08
Assignee
APPLIED MATERIALS, INC.
3050 BOWERS AVENUE, SANTA CLARA, CALIFORNIA, 95054
Covered Property
(1)
Methods and Apparatus for Controlling Warpage in Wafer Level Packaging Processes
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Mar 9, 2021
From: ELUMALAI, KARTHIK
To: APPLIED MATERIALS, INC.
Reel/Frame 055535/0148 →
Assignment of Assignor's Interest
Mar 9, 2021
From: LIANTO, PRAYUDI; RAFI, MOHAMED; SULAIMAN, MUHAMMAD AZIM BIN SYED; SEE, GUAN HUEI
To: APPLIED MATERIALS SINGAPORE TECHNOLOGY PTE. LTD.
Reel/Frame 055535/0515 →
Assignment of Assignor's Interest
Oct 15, 2021
From: APPLIED MATERIALS SINGAPORE TECHNOLOGY PTE. LTD.
To: APPLIED MATERIALS, INC.
Reel/Frame 057806/0282 →