Patent Assignment
Reel/Frame 055535/0515
Assignment of Assignor's Interest
Recorded: 2021-03-09
Pages: 6
Assignors
LIANTO, PRAYUDI
Executed: 2019-10-08
RAFI, MOHAMED
Executed: 2019-10-11
SULAIMAN, MUHAMMAD AZIM BIN SYED
Executed: 2019-10-08
SEE, GUAN HUEI
Executed: 2019-10-08
KRISTY, ANG YU XIN
Executed: 2021-03-04
THIRUNAVUKARASU, SRISKANTHARAJAH
Executed: 2019-10-08
SUNDARRAJAN, ARVIND
Executed: 2019-10-09
Assignee
APPLIED MATERIALS SINGAPORE TECHNOLOGY PTE. LTD.
8 UPPER CHANGI ROAD NORTH, APPLIED MATERIALS BUILDING, SINGAPORE, 506906, SINGAPORE
Covered Property
(1)
Methods and Apparatus for Controlling Warpage in Wafer Level Packaging Processes
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Oct 16, 2019
From: ELUMALAI, KARTHIK
To: APPLIED MATERIALS, INC.
Reel/Frame 050734/0902 →
Assignment of Assignor's Interest
Mar 9, 2021
From: ELUMALAI, KARTHIK
To: APPLIED MATERIALS, INC.
Reel/Frame 055535/0148 →
Assignment of Assignor's Interest
Oct 15, 2021
From: APPLIED MATERIALS SINGAPORE TECHNOLOGY PTE. LTD.
To: APPLIED MATERIALS, INC.
Reel/Frame 057806/0282 →