Patent Assignment
Reel/Frame 050769/0041
Assignment of Assignor's Interest
Recorded: 2019-10-20
Pages: 5
Assignors
CHEN, MING-FA
Executed: 2019-10-08
WU, NIEN-FANG
Executed: 2019-10-08
YEH, SUNG-FENG
Executed: 2019-10-08
LIU, TZUAN-HORNG
Executed: 2019-10-08
SHIH, CHAO-WEN
Executed: 2019-10-08
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Semiconductor Packages and Method of Forming the Same