IP Library Assignment 050776/0572
Patent Assignment
Reel/Frame 050776/0572

Assignment of Assignor's Interest

Recorded: 2019-10-21 Pages: 7
Assignors
HARADA, MINORU
Executed: 2019-09-10
TAKAGI, YUJI
Executed: 2019-09-05
KONDO, NAOAKI
Executed: 2019-09-04
HIRAI, TAKEHIRO
Executed: 2019-09-10
MINEKAWA, YOHEI
Executed: 2019-09-06
Assignee
HITACHI HIGH-TECHNOLOGIES CORPORATION
24-14, NISHI-SHIMBASHI 1-CHOME, MINATO-KU, TOKYO, 105-8717, JAPAN
Covered Property (1)
Defect Observation System and Defect Observation Method for Semiconductor Wafer
Application: 16/567,687 →
Publication: US 2020/0083017
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name Mar 25, 2020
From: HITACHI HIGH-TECHNOLOGIES CORPORATION
To: HITACHI HIGH-TECH CORPORATION
Reel/Frame 052225/0894 →