Patent Assignment
Reel/Frame 050798/0926
Assignment of Assignor's Interest
Recorded: 2019-10-23
Pages: 5
Assignors
SHEU, BEN-LI
Executed: 2019-09-26
LIU, FENG Q.
Executed: 2019-09-26
HA, TAE HONG
Executed: 2019-09-26
CHANG, MEI
Executed: 2019-10-02
PETHE, SHIRISH
Executed: 2019-09-27
Assignee
APPLIED MATERIALS, INC.
3050 BOWERS AVENUE, SANTA CLARA, CALIFORNIA, 95054
Covered Property
(1)
Integration Of ALD Copper With High Temperature PVD Copper Deposition For BEOL Interconnect