Patent Assignment
Reel/Frame 050870/0799
Assignment of Assignor's Interest
Recorded: 2019-10-31
Pages: 8
Assignors
CHOCKALINGAM, RAMASAMY
Executed: 2019-10-30
TAN, JUAN BOON
Executed: 2019-10-31
LEONG, CHEE KONG
Executed: 2019-10-29
RAJOO, RANJAN
Executed: 2019-10-25
RAO, XUESONG
Executed: 2019-10-29
LI, XIAODONG
Executed: 2019-10-31
Assignee
GLOBALFOUNDRIES SINGAPORE PTE. LTD.
60 WOODLANDS INDUSTRIAL PARK D STREET 2, SINGAPORE, 738406, SINGAPORE
Covered Property
(1)
Bond Pads of Semiconductor Devices