Patent Assignment
Reel/Frame 050871/0708
Assignment of Assignor's Interest
Recorded: 2019-10-29
Pages: 2
Assignor
SHIBATA, HIROSHI
Executed: 2019-10-08
Assignee
LAPIS SEMICONDUCTOR CO., LTD.
2-4-8 SHINYOKOHAMA, KOUHOKU-KU, YOKOHAMA, 222-8575, JAPAN
Covered Property
(1)
Semiconductor Wafer Manufacturing Method and Semiconductor Device