IP Library › Assignment 050877/0474
Patent Assignment
Reel/Frame 050877/0474

Assignment of Assignor's Interest

Recorded: 2019-10-31 Pages: 3
Assignors
LEE, JONGWON
Executed: 2019-10-01
SON, DONGIL
Executed: 2019-10-01
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property (1)
Circuit Board Assembly and Electronic Device Including the Same
Application: 16/659,075 →
Publication: US 2020/0127361