Circuit board assembly and electronic device including the same

1. An electronic device comprising:

a circuit board;

a plurality of electronic elements disposed on one surface of the circuit board; an interposer including an at least partially covered opening and being disposed on the one surface of the circuit board such that a specific electronic element of the plurality of electronic elements is disposed in an inner space of the interposer;

a shield can disposed to be in contact with one surface of the interposer so as to cover the specific electronic element; and

a thermal interface material configured to radiate heat generated from the specific electronic element and disposed between the specific electronic element and the shield can,

wherein the interposer comprises one or more signal wires electrically connected to the specific electronic element, and

wherein a coating is formed on a side surface of the interposer.

2. The electronic device of claim 1 ,

wherein the interposer comprises multiple layers.

3. The electronic device of claim 2 ,

wherein the interposer comprises a flexible substrate extending from the interposer and being configured to extend from at least some of the multiple layers of the interposer.

4. The electronic device of claim 3 , wherein the interposer comprises:

a first sub circuit board disposed on one surface of the circuit board and configured as an interposer between the specific electronic element and the opening; and

a second sub circuit board disposed on one surface of the first sub circuit board and disposed to fix the first sub circuit board.

5. The electronic device of claim 4 ,

wherein the second sub circuit board comprises multiple layers, and

wherein the flexible substrate extends from at least two of the multiple layers.

6. The electronic device of claim 3 ,

wherein the opening is used to radiate heat generated in the specific electronic element via the shield can, and

wherein the flexible substrate is installed integrally with the interposer.

7. The electronic device of claim 3 , wherein the flexible substrate comprises a connector for connection to an external device, and extends to an outside of the electronic device through a surface opposite a side surface forming a space of the interposer in which the specific electronic element is disposed.

8. The electronic device of claim 7 ,

wherein the interposer is configured an inside filled with a conductor.

9. The electronic device of claim 8 ,

wherein the interposer is configured to receive one end of the flexible substrate between at least two of the multiple layers.

10. The electronic device of claim 7 ,

wherein the interposer has at least one opening formed to correspond to a position at which the specific electronic element is disposed.

11. The electronic device of claim 7 , wherein a via and a signal pad are arranged in the interposer to exchange an electrical signal.

12. The electronic device of claim 11 ,

wherein the connector of the flexible substrate and the specific electronic element are configured to be electrically connected through the via and the signal pad of the interposer.

13. The electronic device of claim 7 ,

wherein the connector is disposed to be electrically connected to an element configured to process an intermediate-frequency signal.

14. The electronic device of claim 7 , further comprising:

a main circuit board electrically connected through the flexible substrate extending from the interposer.

15. The electronic device of claim 1 ,

wherein the interposer comprises a module interface configured to electrically connect the specific electronic element and another circuit board.