Patent Assignment
Reel/Frame 050882/0749
Assignment of Assignor's Interest
Recorded: 2019-10-31
Pages: 8
Assignors
YERUVA, SURESH
Executed: 2019-04-29
FAY, OWEN R.
Executed: 2018-12-04
VADHAVKAR, SAMEER S.
Executed: 2019-03-27
JEBARAJ, ADRIEL JEBIN JACOB
Executed: 2019-03-28
HUANG, WAYNE H.
Executed: 2019-10-31
Assignee
MICRON TECHNOLOGY, INC.
8000 S. FEDERAL WAY, P.O. BOX 6, BOISE, IDAHO, 83707-0006
Covered Property
(1)
Methods and Systems for Manufacturing Pillar Structures on Semiconductor Devices
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Supplement No. 12 to Patent Security Agreement
Apr 19, 2019
From: MICRON TECHNOLOGY, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
Reel/Frame 048948/0677 →
Supplement No. 3 to Patent Security Agreement
Apr 19, 2019
From: MICRON TECHNOLOGY, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 048951/0902 →
Release of Security Interest
Oct 14, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 050724/0392 →
Release of Security Interest
Nov 15, 2019
From: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 051041/0317 →