Patent Assignment
Reel/Frame 050897/0326
Assignment of Assignor's Interest
Recorded: 2019-10-31
Pages: 3
Assignor
CHENG, HONGFEI
Executed: 2019-09-10
Assignee
BOE TECHNOLOGY GROUP CO., LTD.
NO.10 JIUXIANQIAO RD., CHAOYANG DISTRICT, BEIJING, 100015, CHINA
Covered Property
(1)
Array Substrate and Fabrication Method Thereof, Array Substrate Motherboard and Display Device